Characteristics and Comparisons of Other Conductors

Characteristic

Bare Copper (CU)

Tin Plated Copper (TC)

Silver Plated Copper (SC)

Nickel Plated Copper (NC)

Life
Stability

EXCELLENT- Slight loss of conductivity with heat aging

Conductivity and solderability deteriorates with heat aging at rated temperature due to migration of tin and copper and tin oxidation

EXCELLENT- no loss of conductivity with heat aging at rated temperature. Solderability shelf life remains good

Conductivity remains stable with heat aging at rated temperature

Crimp
Terminability

EXCELLENT- Contact resistance may vary with type of terminal

GOOD- But contact resistance increases with time and can be variable

EXCELLENT- Contact resistance remains low

GOOD- But contact resistance may vary with time. Use plated steel terminal in some cases.

Solder

GOOD- When Clean

GOOD- originally Deteriorates with shelf life

EXCELLENT

Requires active flux

Service
Temperature

210°F (99°C)

300°F (149°C)

390°F (199°C)

480°F (249°C)